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HomeWhite Paper Advanced Packaging Materials for Power Semiconductors
White Paper

Advanced Packaging Materials for Power Semiconductors

Advanced Packaging Materials for Power Semiconductors

Advances in electric vehicles (xEVs) demand smaller, high-performance drive systems, and efficient energy use. This necessitates compact and thermal-efficient inverters.

Silicon Carbide (SiC)–as opposed to traditional silicon (Si)–offers superior performance but also needs enhanced heat resistance, insulation, and dissipation.

High-performance packaging materials today include die bonding and encapsulants, that optimize thermal management and reliability and leverage organic and inorganic materials.

Read this white paper to explore breakthrough packaging solutions for power semiconductors, including:

  • High-performance sintered copper paste
  • Heat-resistant epoxy compounds
  • Lightweight aluminum coolers
  • Delamination-resistant HIMAL coating, and more

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